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Holistically and economically optimize bonding processes

A secure and economical bonding process does not start with the adhesive alone. The decisive factor is the interplay of materials, surfaces, adhesives, processing technology, and the expertise of the employees. When these factors are coordinated, processes can be specifically improved, sources of error reduced, and cost potentials identified.

However, often only individual components are optimized while the entire workflow remains unconsidered. This is exactly where Innotech applies a holistic, manufacturer-neutral approach.

At the Game-Changer Event on October 20, 2026, in Mannheim, we demonstrate why it is worthwhile to rethink bonding processes.

Profitability begins with the entire bonding process

What does a bond actually cost?

Those who only consider the price of the adhesive or a cartridge dispenser often overlook additional cost factors. These include, for example, labor time, material consumption, scrap, rework, and inefficient processing steps.

Our approach, Total Cost of Bonding (TCB), therefore does not focus on individual products but on the total costs of the bonding process.

Central questions are at the core:

  • Where do unnecessary costs or time losses occur?
  • Is the processing technology used tailored to the application?
  • How can dosing and adhesive application be improved?
  • Which measures can reduce errors and rework?
  • How can targeted training support process reliability?

The greatest optimization potential often lies not in a new product but in a better coordinated bonding process.

Manufacturer-neutral consulting. Holistic improvement.

As a manufacturer-neutral system partner, Innotech combines technical expertise, suitable processing technology, services, and consulting into a holistic solution approach.

We consider the entire workflow – from selecting suitable processing components through adhesive application to employee qualification.

Whether cartridge dispensers, nozzles, static mixers, or individual process consulting: the decisive factor is not the individual product but the solution that fits the respective application.

Our goal: to make bonding processes safer, more efficient, and more economical.

Companies benefit from an independent assessment of their requirements and practical solution approaches that combine technical and economic aspects.

New perspectives at the Game-Changer Event 2026

How much optimization potential is hidden in existing bonding processes? And which changes can really make a difference in everyday work?

We want to discuss exactly these questions at the Game-Changer Event with experts from design, development, production, and quality assurance.

Luca Süß, Head of Sales & Service at Innotech, sums it up:

"Anyone who wants to make their bonding processes safer and more economical should not miss the Game-Changer Event!"

The focus is on personal exchange. Because those who question existing workflows, incorporate new perspectives, and consider technical contexts holistically can discover previously untapped potentials.

Visit us at the Innotech Innovation Point and bring your specific challenges. Together, we will discuss which approaches may be suitable for your application.

Meet Innotech in Mannheim!

The Game-Changer Event by ISGATEC brings together experts and innovative solution approaches from the fields of sealing, bonding, and polymers. An opportunity to exchange experiences, gain new impulses, and discuss concrete questions.

Event details at a glance:

  • Date: October 20, 2026
  • Time: approx. 9:30 a.m. to 5:00 p.m.
  • Location: Radisson Blu Hotel, Mannheim
  • Meet & Talk: October 19, 2026, the evening before
  • Innotech on site: Luca Süß, Head of Sales & Service

Take the opportunity to view your bonding processes from a new perspective. We look forward to personal exchange with you!

Learn more about the Game-Changer Event and register now

Further information on our holistic approach can be found in the ISGATEC specialist article:

Game-Changer: Holistically and economically optimize bonding processes

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