Your expertise deserves a stage.
Submit your technical paper now and present your knowledge of bonding and sealing to a broad specialist audience. Take the opportunity to publish your findings in both the print and digital versions (German & English) of the Almanac. Benefit from maximum visibility and reach specialists, manufacturers and retailers in a targeted manner.
Soon our new series of articles will start on LinkedIn - we will introduce you to the new specialist articles of the 7th edition. Follow us now to make sure you never miss a post!
More information & conditions of participation.
Frequently Asked Questions (FAQ)
Question: What is the purpose of the Call for Papers for the 8th edition of the Almanac?
Answer: The Call for Papers invites professionals to submit their technical articles on bonding and sealing. Authors can present their expertise to a broad specialist audience and contribute valuable insights to the upcoming Almanac edition.
Question: What are the benefits of publishing a technical article in the Almanac?
Answer: Articles are published in both the print and digital editions of the Almanac, in German and English. This ensures maximum visibility and allows authors to reach targeted professionals, manufacturers, and distributors in the industry.
Question: Who can submit a contribution to the Almanac?
Answer: Experts from industry, research, engineering, and trade are invited to submit their knowledge on adhesive and sealing technologies. The Almanac is aimed at those who want to advance innovation and expertise in this field.
Question: How can I find more information about the participation requirements?
Answer: All details about submission guidelines, topic areas, and required formats can be found in the linked participation information. There you can see exactly how and by when a technical article can be submitted.
Question: What can I expect from the upcoming LinkedIn article series?
Answer: Innotech will present the new technical contributions from the 7th edition of the Almanac and provide exclusive insights into current topics related to bonding and sealing. By following the LinkedIn page, you won’t miss any part of the series.